60% lower parasitic inductance and improved thermal performance

A series of half-bridge (high side & low side) MOSFETs constructed in the space-saving LFPAK56D package format. Occupying 30% lower PCB area compared to dual MOSFETs for 3 phase motor control topologies due to the removal of PCB tracks whilst permitting simple automated optical inspection (AOI) during production. The LFPAK56D half-bridge utilises existing high volume LFPAK56D assembly processes. The package format uses flexible leads to improve overall reliability, and an internal copper clip connection between the MOSFETs simplifies PCB designs and brings a plug and play style solution with exceptional current handling capability.