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雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

GANB012-040CBA

40 V, 12 mOhm bi-directional Gallium Nitride (GaN) FET in a 1.2 mm x 1.7 mm Wafer Level Chip-Scale Package (WLCSP)

The GANB012-040CBA is a 40 V, 12 mΩ bi-directional Gallium Nitride (GaN) High Electron-Mobility-Transistor (HEMT) in a Wafer Level Chip-Scale (WLCSP) package. It is a normally-off e-mode device offering superior performance.

Features and benefits

  • Enhancement mode - normally-off power switch

  • Bi-directional device

  • Ultra high switching speed capability

  • Ultra-low on-state resistance

  • RoHS, Pb-free, REACH-compliant

  • High efficiency and high power density

  • Wafer Level Chip-Scale Package (WLCSP) 1.2 mm x 1.7 mm

Applications

  • High-side load switch

  • OVP protection in smart phone USB port

  • DC-to-DC converters

  • Power switch circuits

  • Stand-by power system

參數(shù)類型

型號 Package version Package name Product status Nr of transistors VDS [max] (V) RDSon [max] @ VGS = 5 V (mΩ) Tj [max] (°C) ID [max] (A) QGD [typ] (nC) Ptot [max] (W) VGSth [typ] (V) Ciss [typ] (pF) Coss [typ] (pF) Release date
GANB012-040CBA WLCSP12_SOT8088 WLCSP12 Production 1 40 12 125 10 1.9 11 1.35 405 174 2024-04-03

封裝

型號 可訂購的器件編號,(訂購碼(12NC)) 狀態(tài) 標(biāo)示 封裝 外形圖 回流焊/波峰焊 包裝
GANB012-040CBA GANB012-040CBAZ
(934667632336)
Active 012ACBA WLCSP12_SOT8088
WLCSP12
(WLCSP12_SOT8088)
WLCSP12_SOT8088 WLCSP12_SOT8088_336

環(huán)境信息

型號 可訂購的器件編號 化學(xué)成分 RoHS RHF指示符
GANB012-040CBA GANB012-040CBAZ GANB012-040CBA rohs rhf rhf
品質(zhì)及可靠性免責(zé)聲明

文檔 (5)

文件名稱 標(biāo)題 類型 日期
GANB012-040CBA 40 V, 12 mOhm bi-directional Gallium Nitride (GaN) FET in a 1.2 mm x 1.7 mm Wafer Level Chip-Scale Package (WLCSP) Data sheet 2025-03-12
AN90004 Probing considerations for fast switching applications Application note 2019-11-15
AN90041 Gate drive circuit design for Nexperia 650 V Enhancement mode (e-mode) GaN FETs Application note 2023-05-09
WLCSP12_SOT8088 WLCSP12: wafer level chip-size package; 12 bumps (4 x 3) Package information 2025-01-16
WLCSP12_SOT8088_336 WLCSP12; Reel dry pack for SMD, 7"; Q1/T1 product orientation Packing information 2024-03-28

支持

如果您需要設(shè)計(jì)/技術(shù)支持,請告知我們并填寫 應(yīng)答表 我們會盡快回復(fù)您。

模型

No documents available

訂購、定價(jià)與供貨

型號 Orderable part number Ordering code (12NC) 狀態(tài) 包裝 Packing Quantity 在線購買
GANB012-040CBA GANB012-040CBAZ 934667632336 Active WLCSP12_SOT8088_336 2,500 訂單產(chǎn)品

樣品

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How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

可訂購部件

型號 可訂購的器件編號 訂購代碼(12NC) 封裝 從經(jīng)銷商處購買
GANB012-040CBA GANB012-040CBAZ 934667632336 WLCSP12_SOT8088 訂單產(chǎn)品
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