外形圖
| 封裝版本 | 封裝名稱 | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT8047-1 | HWSON | plastic thermal enhanced very very thin small outline package; no leads; 8 terminals; 0.8 mm pitch; 4 x 4 x 0.75 mm body | MO-229 compatible (JEDEC) | 2022-03-16 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT8047-1 | plastic thermal enhanced very very thin small outline package; no leads;8 terminals; 0.8 mm pitch; 4 x 4 x 0.75 mm body | Package information | 2024-08-21 |
| SOT8047-1_118 | HWSON8; Reel pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2024-09-19 |