外形圖
| 封裝版本 | 封裝名稱(chēng) | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT530-1 | TSSOP8 | plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body | MO-153 (JEDEC) | 2003-02-18 |
相關(guān)文檔
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| SOT530-1 | 3D model for products with SOT530-1 package | Design support | 2023-02-07 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT530-1 | plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-03 |
| SOT530-1_118 | TSSOP8; Reel pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2022-10-12 |
采用此封裝的產(chǎn)品
Analog & Logic ICs
| 型號(hào) | 描述 | 快速訪(fǎng)問(wèn) |
|---|---|---|
| CBT3306PW | Dual bus switch | |
| CBTD3306PW | Dual bus switch with level shifting |
Automotive qualified products (AEC-Q100/Q101)
| 型號(hào) | 描述 | 快速訪(fǎng)問(wèn) |
|---|