外形圖
| 封裝版本 | 封裝名稱 | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT1216 | DFN1010B-6 | plastic, leadless thermal enhanced ultra thin small outline package; 6 terminals; 0.35 mm pitch; 1.1 mm x 1 mm x 0.37 mm body | 2013-03-06 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| AN90032 | Low temperature soldering, application study | Application note | 2022-02-22 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| SOT1216 | 3D model for products with SOT1216 package | Design support | 2019-10-07 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1010B-6_SOT1216_mk | plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body | Marcom graphics | 2017-01-28 |
| SOT1216 | plastic, leadless thermal enhanced ultra thin small outline package; 6 terminals; 0.35 mm pitch; 1.1 mm x 1 mm x 0.37 mm body | Package information | 2022-09-08 |
| SOT1216_147 | DFN1010B-6; Reel pack for SMD, 7''; Q2/T3 product orientation | Packing information | 2020-06-12 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
采用此封裝的產(chǎn)品
Automotive qualified products (AEC-Q100/Q101)
| 型號(hào) | 描述 | 快速訪問(wèn) |
|---|---|---|
| PQMH13-Q | NPN/NPN resistor-equipped double transistor; R1?=?4.7?k?,?R2?=?47?k? |
|