74HC373; 74HCT373
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74HC373BQ | 2.0?-?6.0 | CMOS | ± 7.8 | 12 | low | -40~125 | 78 | 9.1 | 50 | DHVQFN20 |
| 74HC373D | 2.0?-?6.0 | CMOS | ± 7.8 | 12 | low | -40~125 | 85 | 27.3 | 61 | SO20 |
| 74HC373PW | 2.0?-?6.0 | CMOS | ± 7.8 | 12 | low | -40~125 | 100 | 4.6 | 44.7 | TSSOP20 |
| 74HCT373BQ | 4.5?-?5.5 | TTL | ± 6 | 14 | low | -40~125 | 78 | 9.1 | 50 | DHVQFN20 |
| 74HCT373D | 4.5?-?5.5 | TTL | ± 6 | 14 | low | -40~125 | 85 | 27.3 | 61 | SO20 |
| 74HCT373PW | 4.5?-?5.5 | TTL | ± 6 | 14 | low | -40~125 | 100 | 4.6 | 44.7 | TSSOP20 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC373BQ | 74HC373BQ,115 (935274585115) |
Active | HC373BQ |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74HC373D | 74HC373D,653 (933715470653) |
Active | 74HC373D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
暫無信息 |
| 74HC373PW | 74HC373PW,118 (935165240118) |
Active | HC373 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
| 74HCT373BQ | 74HCT373BQ,115 (935274584115) |
Active | HCT373BQ |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74HCT373D | 74HCT373D,653 (933715580653) |
Active | 74HCT373D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
暫無信息 |
| 74HCT373PW | 74HCT373PW,118 (935174830118) |
Active | HCT373 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC373DB | 74HC373DB,112 (935174840112) |
Withdrawn / End-of-life |
SSOP20 (SOT339-1) |
SOT339-1 |
SSOP-TSSOP-VSO-WAVE
|
暫無信息 | |
| 74HC373DB,118 (935174840118) |
Withdrawn / End-of-life | SOT339-1_118 | |||||
| 74HCT373DB | 74HCT373DB,112 (935174850112) |
Obsolete | no package information | ||||
| 74HCT373DB,118 (935174850118) |
Obsolete | ||||||
| 74HCT373PW | 74HCT373PW,112 (935174830112) |
Withdrawn / End-of-life | HCT373 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
暫無信息 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC373BQ | 74HC373BQ,115 | 74HC373BQ |
|
|
| 74HC373D | 74HC373D,653 | 74HC373D |
|
|
| 74HC373PW | 74HC373PW,118 | 74HC373PW |
|
|
| 74HCT373BQ | 74HCT373BQ,115 | 74HCT373BQ |
|
|
| 74HCT373D | 74HCT373D,653 | 74HCT373D |
|
|
| 74HCT373PW | 74HCT373PW,118 | 74HCT373PW |
|
|
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC373DB | 74HC373DB,112 | 74HC373DB |
|
|
| 74HC373DB | 74HC373DB,118 | 74HC373DB |
|
|
| 74HCT373DB | 74HCT373DB,112 | 74HCT373DB |
|
|
| 74HCT373DB | 74HCT373DB,118 | 74HCT373DB |
|
|
| 74HCT373PW | 74HCT373PW,112 | 74HCT373PW |
|
|
文檔 (16)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74HC_HCT373 | Octal D-type transparent latch; 3-state | Data sheet | 2024-08-05 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT339-1 | plastic, shrink small outline package; 20 leads; 0.65 mm pitch; 7.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
Ordering, pricing & availability
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