74AUP1G34

下載數(shù)據(jù)手冊
訂單產(chǎn)品

封裝

型號	可訂購的器件編號，（訂購碼(12NC)）	狀態(tài)	標(biāo)示	封裝	外形圖	回流焊/波峰焊	包裝
74AUP1G34GM	74AUP1G34GM,115 (935279029115)	Active	aN	XSON6 (SOT886)	SOT886	REFLOW_BG-BD-1	SOT886_115
74AUP1G34GM	74AUP1G34GM,132 (935279029132)	Active	aN	XSON6 (SOT886)	SOT886		SOT886_132
74AUP1G34GN	74AUP1G34GN,132 (935291737132)	Active	aN	XSON6 (SOT1115)	SOT1115	REFLOW_BG-BD-1	SOT1115_132
74AUP1G34GS	74AUP1G34GS,132 (935292862132)	Active	aN	XSON6 (SOT1202)	SOT1202	REFLOW_BG-BD-1	SOT1202_132
74AUP1G34GW	74AUP1G34GW,125 (935279028125)	Active	aN	TSSOP5 (SOT353-1)	SOT353-1	WAVE_BG-BD-1	SOT353-1_125
74AUP1G34GX	74AUP1G34GX,125 (935298363125)	Active	aN	X2SON5 (SOT1226-3)	SOT1226-3		SOT1226-3_125
74AUP1G34GX4	74AUP1G34GX4Z (935340118147)	Active	aN	X2SON4 (SOT1269-2)	SOT1269-2		SOT1269-2_147

下表中的所有產(chǎn)品型號均已停產(chǎn) 。

型號	可訂購的器件編號，（訂購碼(12NC)）	狀態(tài)	標(biāo)示	封裝	外形圖	回流焊/波峰焊	包裝
74AUP1G34GF	74AUP1G34GF,132 (935281114132)	Obsolete		no package information

環(huán)境信息

型號	可訂購的器件編號	化學(xué)成分
74AUP1G34GM	74AUP1G34GM,115	74AUP1G34GM
74AUP1G34GM	74AUP1G34GM,132	74AUP1G34GM
74AUP1G34GN	74AUP1G34GN,132	74AUP1G34GN
74AUP1G34GS	74AUP1G34GS,132	74AUP1G34GS
74AUP1G34GW	74AUP1G34GW,125	74AUP1G34GW
74AUP1G34GX	74AUP1G34GX,125	74AUP1G34GX
74AUP1G34GX4	74AUP1G34GX4Z	74AUP1G34GX4

下表中的所有產(chǎn)品型號均已停產(chǎn) 。

型號	可訂購的器件編號	化學(xué)成分	RoHS	RHF指示符
74AUP1G34GF	74AUP1G34GF,132	74AUP1G34GF

品質(zhì)及可靠性免責(zé)聲明

文檔 (33)

文件名稱	標(biāo)題	類型	日期
74AUP1G34	Low-power buffer	Data sheet	2024-09-23
AN10161	PicoGate Logic footprints	Application note	2002-10-29
AN11052	Pin FMEA for AUP family	Application note	2019-01-09
Nexperia_document_guide_MiniLogic_MicroPak_201808	MicroPak leadless logic portfolio guide	Brochure	2018-09-03
Nexperia_document_guide_MiniLogic_PicoGate_201901	PicoGate leaded logic portfolio guide	Brochure	2019-01-07
SOT886	3D model for products with SOT886 package	Design support	2019-10-03
SOT1115	3D model for products with SOT1115 package	Design support	2023-02-02
SOT1202	3D model for products with SOT1202 package	Design support	2023-02-02
SOT353-1	3D model for products with SOT353-1 package	Design support	2019-09-23
SOT1226-3	3D model for products with SOT1226-3 package	Design support	2021-01-28
SOT1269-2	3D model for products with SOT1269-2 package	Design support	2023-02-02
SOT1269	3D model for products with SOT1269 package	Design support	2019-10-07
aup1g34	74AUP1G34 IBIS model	IBIS model	2018-05-25
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904	Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904	Leaflet	2019-04-12
Nexperia_document_leaflet_Logic_X2SON_packages_062018	X2SON ultra-small 4, 5, 6 & 8-pin leadless packages	Leaflet	2018-06-05
Nexperia_package_poster	Nexperia package poster	Leaflet	2020-05-15
DFN1410-6_SOT886_mk	plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body	Marcom graphics	2017-01-28
XSON6_SOT886_mk	plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body	Marcom graphics	2017-01-28
XSON6_SOT1115_mk	plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body	Marcom graphics	2017-01-28
TSSOP5_SOT353-1_mk	plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body	Marcom graphics	2018-07-25
XSON4_SOT1269-2_mk	plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body	Marcom graphics	2019-02-04
SOT886	plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body	Package information	2022-06-01
SOT1115	plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body	Package information	2022-05-27
SOT1202	plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body	Package information	2022-06-01
SOT353-1	plastic thin shrink small outline package; 5 leads; body width 1.25 mm	Package information	2022-11-15
SOT1226-3	plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm	Package information	2020-08-27
SOT1269-2	plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body	Package information	2020-08-18
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
Nexperia_Selection_guide_2023	Nexperia Selection Guide 2023	Selection guide	2023-05-10
MAR_SOT886	MAR_SOT886 Topmark	Top marking	2013-06-03
MAR_SOT1115	MAR_SOT1115 Topmark	Top marking	2013-06-03
MAR_SOT1202	MAR_SOT1202 Topmark	Top marking	2013-06-03
WAVE_BG-BD-1	Wave soldering profile	Wave soldering	2021-09-08

支持

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模型

文件名稱	標(biāo)題	類型	日期
SOT886	3D model for products with SOT886 package	Design support	2019-10-03
SOT1115	3D model for products with SOT1115 package	Design support	2023-02-02
SOT1202	3D model for products with SOT1202 package	Design support	2023-02-02
SOT353-1	3D model for products with SOT353-1 package	Design support	2019-09-23
SOT1226-3	3D model for products with SOT1226-3 package	Design support	2021-01-28
SOT1269-2	3D model for products with SOT1269-2 package	Design support	2023-02-02
SOT1269	3D model for products with SOT1269 package	Design support	2019-10-07
aup1g34	74AUP1G34 IBIS model	IBIS model	2018-05-25

Ordering, pricing & availability

樣品

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所有產(chǎn)品

雙極性晶體管

二極管

ESD保護(hù)、TVS、信號調(diào)節(jié)

MOSFET

SiC MOSFETs

氮化鎵場效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車

所有應(yīng)用

汽車

工業(yè)和電力

移動(dòng)和可穿戴應(yīng)用

計(jì)算和消費(fèi)電子

Sub-systems: Power conversion topologies

子系統(tǒng)

參考設(shè)計(jì)

評估板

Interactive application notes

Advanced Support Tools

74AUP1G34