外形圖
| 封裝版本 | 封裝名稱 | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| WLCSP6_3-2 | WLCSP6 | wafer level chip-size package; 6 bumps (3 x 2) | 2017-04-13 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| WLCSP6_3-2 | 3D model for products with WLCSP6_3-2 package | Design support | 2023-03-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| nexperia_document_leaflet_WLCSP_201803 | Small-signal MOSFETs in WLCSP - Smallest size - lowest RDS(on) | Leaflet | 2018-04-25 |
| nexperia_document_leaflet_WLCSP_201803_CHN | WLCSP Chinese Translation | Leaflet | 2018-04-25 |
| WLCSP6_3-2 | wafer level chip-size package; 6 bumps (3 x 2) | Package information | 2022-07-13 |
采用此封裝的產(chǎn)品
MOSFETs
| 型號(hào) | 描述 | 快速訪問(wèn) |
|---|---|---|
| PMCM6501UNE | 20 V, N-channel Trench MOSFET | |
| PMCM6501UPE | 20 V, P-channel Trench MOSFET |