外形圖
| 封裝版本 | 封裝名稱(chēng) | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT337-1 | SSOP14 | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | MO-150 (JEDEC) | 2003-02-19 |
相關(guān)文檔
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SSOP14_SOT337-1_mk | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
| SOT337-1 | plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
| SOT337-1_118 | SSOP14; Reel pack for SMD, 13''; Q1/T1 product orientation | Packing information | 2020-04-21 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
采用此封裝的產(chǎn)品
Analog & Logic ICs
| 型號(hào) | 描述 | 快速訪(fǎng)問(wèn) |
|---|
Automotive qualified products (AEC-Q100/Q101)
| 型號(hào) | 描述 | 快速訪(fǎng)問(wèn) |
|---|