外形圖
| 封裝版本 | 封裝名稱 | 封裝說(shuō)明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| OL-PMCM6501VNE | WLCSP6 | WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) | 2015-07-07 |
相關(guān)文檔
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| OL-PMCM6501VNE | 3D model for products with OL-PMCM6501VNE package | Design support | 2023-03-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| OL-PMCM6501VNE | WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) | Package information | 2022-07-13 |
| WLCSP6_023 | PMCM650xxxx; Reel pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2020-06-23 |
| pmcm6501vne-ssmos_fr | pmcm6501vne-ssmos_fr | Reflow soldering | 2015-07-10 |
采用此封裝的產(chǎn)品
MOSFETs
| 型號(hào) | 描述 | 快速訪問(wèn) |
|---|---|---|
| PMCM6501VNE | 12 V, N-channel Trench MOSFET |