化學成分 BUK768R3-60E

作為一家積極進取的可持續(xù)發(fā)展公司，安世半導體已決定直接通過互聯網發(fā)布其產品組合的化學成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關資料，以協助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估?？蛻艨梢灾苯訌囊话惝a品數據庫檢索中獲取這些詳細的數據，這是安世半導體為半導體產業(yè)設下的一個行業(yè)標準。安世半導體產品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934066644118	BUK768R3-60E,118	BUK768R3-60E	SOT404 (D2PAK)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 2246 ppm of the article. SCIP No. f418fbbb-02c3-4537-b339-5fe68689b4f8.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHS	Not compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 4004 ppm; substance 1309-64-4: 7171 ppm; substance 1333-86-4: 796 ppm; substance 7439-92-1: 2246 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 4004 ppm; substance 1309-64-4: 7171 ppm; substance 40039-93-8: 5976 ppm; substance 1333-86-4: 796 ppm; substance 7439-92-1: 2246 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 36 ppm;
RHF Indicator	Contains EU RoHS-exempted lead and halogens according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die	Doped silicon	Silicon (Si)	7440-21-3	2.800000	100.000000	0.195547
		Die Total		2.800000	100.000000	0.195547

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	822.509979	98.970000	57.442802
Lead Frame	Copper alloy	Nickel (Ni)	7440-02-0	5.734383	0.690000	0.400480
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	1.994568	0.240000	0.139298
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	0.831070	0.100000	0.058041
		Lead Frame Total		831.070000	100.000000	58.040621

Mould Compound	Filler	Silica fused	60676-86-0	427.890000	75.000000	29.883164
Mould Compound	Polymer	Epoxy resin system		81.774514	14.333330	5.711003
Mould Compound	Polymer	Phenolic resin		40.887286	7.166670	2.855504
Mould Compound	Flame retardant	Antimony trioxide (Sb2O3)	1309-64-4	10.269360	1.800000	0.717196
Mould Compound	Flame retardant	Epichlorohydrin-tetrabromobisphenol A copolymer	40039-93-8	8.557800	1.500000	0.597663
Mould Compound	Pigment	Carbon black	1333-86-4	1.141040	0.200000	0.079689
		Mould Compound Total		570.520000	100.000000	39.844219

Post-Plating	Tin alloy	Tin (Sn)	7440-31-5	19.788021	99.990000	1.381964
Post-Plating	Impurity	Non-declarable		0.001979	0.010000	0.000138
		Post-Plating Total		19.790000	100.000000	1.382102

Wire 1	Pure metal	Aluminium (Al)	7429-90-5	4.000074	99.990000	0.279359
Wire 1	Impurity	Non-declarable		0.000400	0.010000	0.000028
		Wire Total		4.000474	100.000000	0.279387
		Wire 1 Total		4.000474	100.000000	0.279387

Wire 2	Pure metal	Aluminium (Al)	7429-90-5	0.255106	99.990000	0.017816
Wire 2	Impurity	Non-declarable		0.000026	0.010000	0.000002
		Wire Total		0.255132	100.000000	0.017818
		Wire 2 Total		0.255132	100.000000	0.017818

Solder Wire	Lead alloy	Lead (Pb)	7439-92-1	3.217223	93.500000	0.224686
Solder Wire	Lead alloy	Tin (Sn)	7440-31-5	0.172044	5.000000	0.012015
Solder Wire	Lead alloy	Silver (Ag)	7440-22-4	0.051613	1.500000	0.003605
		Solder Wire Total		3.440880	100.000000	0.240306

		BUK768R3-60E Total		1431.876486		100.000000

Notes
Report created on 2025-03-08 20:11:22 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
245 °C	40 s	220 °C	30 s	3

Notes
Report created on 2025-03-08 20:11:22 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯苯 (PBB)	多溴二苯醚 (PBDE)
半導體芯片 (Die)	?	?	?	?	?	?
引線框架 (Lead Frame)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導線 (Wire)	?	?	?	?	?	?
導線 (Wire)	?	?	?	?	?	?
焊錫絲 (Solder Wire)	?	?	?	?	?	?

?	表示該有害物質在該部件所有均質材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質至少在該部件的某一均質材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導體產品具有無限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-03-08 20:11:22 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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化學成分 BUK768R3-60E

雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調節(jié)ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產品(AEC-Q100/Q101)

化學成分 BUK768R3-60E

ESD保護、TVS、濾波和信號調節(jié)ESD保護